A mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die. Their usage has grown dramatically with the increased use of cell phones, telecommunications, portable electronics, and automobiles with electronics and digital sensors.
Overview Integrated circuits (ICs) are generally classified as digital (e.g. a microprocessor) or analog (e.g. an operational amplifier). Mixed-signal ICs contain both digital and analog circuitry on the same chip, and sometimes embedded software. Mixed-signal ICs process both analog and digital signals together. For example, an analog-to-digital converter (ADC) is a typical mixed-signal circuit. Mixed-signal ICs are often used to convert analog signals to digital signals so that digital devices can process them. For example, mixed-signal ICs are essential components for FM tuners in digital products such as media players, which have digital amplifiers. Any analog signal can be digitized using a very basic ADC, and the smallest and most energy efficient of these are mixed-signal ICs. Mixed-signal ICs are more difficult to design and manufacture than analog-only or digital-only integrated circuits. For example, an efficient mixed-signal IC may have its digital and analog components share a common power supply. However, analog and digital components have very different power needs and consumption characteristics, which makes this a non-trivial goal in chip design. Mixed-signal functionality involves both traditional active elements (like transistors) and well-performing passive elements (like coils, capacitors, and resistors) on the same chip. This requires additional modelling understanding and options from manufacturing technologies. High voltage transistors might be needed in the power management functions on a chip with digital functionality, possibly with a low-power CMOS processor system. Some advanced mixed-signal technologies may enable combining analog sensor elements (like pressure sensors or imaging diodes) on the same chip with an ADC. Typically, mixed-signal ICs do not necessarily need the fastest digital performance. Instead, they need more mature models of active and passive elements for more accurate simulations and verification, such as for testability planning and reliability estimations. Therefore, mixed-signal circuits are typically realized with larger line widths than the highest speed and densest digital logic, and the implementation technologies can be two to four generations behind the latest digital-only implementation technologies. Additionally, mixed signal processing may need passive elements like resistors, capacitors, and coils, which may require specialized metal, dielectric layers, or similar adaptations of standard fabrication processes. Because of these specific requirements, mixed-signal ICs and digital ICs can have different manufacturers (known as foundries).
Applications There are numerous applications of mixed-signal integrated circuits, such as in mobile phones, modern radio and telecommunication systems, sensor systems with on-chip standardized digital interfaces (including I2C, UART, SPI, or CAN), voice-related signal processing, aerospace and space electronics, the Internet of things (IoT), unmanned aerial vehicles (UAVs), and automotive and other electrical vehicles. Mixed-signal circuits or systems are typically cost-effective solutions, such as for building modern consumer electronics and in industrial, medical, measurement, and space applications. Examples of mixed-signal integrated circuits include data converters using delta-sigma modulation, analog-to-digital converters and digital-to-analog converters using error detection and correction, and digital radio chips. Digitally controlled sound chips are also mixed-signal circuits. With the advent of cellular and network technology, this category now includes cellular telephone, software radio, and LAN and WAN router integrated circuits.
Design and development Typically, mixed-signal chips perform some whole function or sub-function in a larger assembly, such as the radio subsystem of a cell phone, or the read data path and laser SLED control logic of a DVD player. Mixed-signal ICs often contain an entire system-on-a-chip. They may also contain on-chip memory blocks (like OTP), which complicates the manufacturing compared to analog ICs. A mixed-signal IC minimizes off-chip interconnects between digital and analog functionality in the system—typically reducing size and weight due to minimized packaging and a smaller module substrate—and therefore increases the reliability of the system. Because of the use of both digital signal processing and analog circuitry, mixed-signal ICs are usually designed for a very specific purpose. Their design requires a high level of expertise and careful use of computer aided design (CAD) tools. There also exists specific design tools (like mixed-signal simulators) or description languages (like VHDL-AMS). Automated testing of the finished chips can also be challenging. Teradyne, Keysight, and Advantest are the major suppliers of the test equipment for mixed-signal chips. There are several particular challenges of mixed-signal circuit manufacturing:
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